{"version":"1.0","provider_name":"EENewsEurope","provider_url":"https:\/\/www.ecinews.fr\/fr\/","author_name":"Alain Dieul","author_url":"https:\/\/www.ecinews.fr\/fr\/author\/alain-dieul\/","title":"Bo\u00eetiers \u00e0 coque avec dissipateur thermique","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"rAk0xxKxEq\"><a href=\"https:\/\/www.ecinews.fr\/fr\/boitiers-a-coque-avec-dissipateur-thermique\/\">Bo\u00eetiers \u00e0 coque avec dissipateur thermique<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.ecinews.fr\/fr\/boitiers-a-coque-avec-dissipateur-thermique\/embed\/#?secret=rAk0xxKxEq\" width=\"600\" height=\"338\" title=\"\u00ab\u00a0Bo\u00eetiers \u00e0 coque avec dissipateur thermique\u00a0\u00bb &#8212; EENewsEurope\" data-secret=\"rAk0xxKxEq\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/cdn.eenewseurope.com\/wp-content\/uploads\/2022\/12\/ECI1602_fischerelektronik-scaled.jpg","thumbnail_width":1080,"thumbnail_height":720,"description":"La densit\u00e9 d&rsquo;int\u00e9gration croissante des cartes de circuits imprim\u00e9s \u00e9quip\u00e9es ainsi que l&rsquo;augmentation de la chaleur d\u00e9gag\u00e9e par les composants \u00e9lectroniques posent des exigences toujours plus grandes au concept de refroidissement des bo\u00eetiers utilis\u00e9s. Une possibilit\u00e9 de ma\u00eetriser la probl\u00e9matique de la dissipation de chaleur est l&rsquo;utilisation de ce que l&rsquo;on appelle des bo\u00eetiers dissipateurs [&hellip;]"}